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Fiber Attach Service​​
We provide low-loss fiber-attach technology for optical packaging of integrated photonic devices. Our novel fiber-attach technology is a 1 sec process and provides <0.8 dB loss in a fully packaged device. Chips packaged with Photonect are solder reflow compatible and avoid the use of adhesives for packaging.
Mode Converter Designing
We provide low-loss fiber-attach technology for optical packaging of integrated photonic devices. Our novel fiber-attach technology is a 1 sec process and provides <0.8 dB loss in a fully packaged device. Chips packaged with Photonect are solder reflow compatible and avoid the use of adhesives for packaging.
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