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Co-Packaged Optics (CPO) is an architectural approach that integrates optical engines directly alongside switch ASICs on the same substrate. Traditionally, optical transceivers sit at the edge of a system and connect through electrical traces. CPO removes that distance by bringing optics directly next to compute.

Epoxy-based interconnects were sufficient for earlier photonics systems. They are not sufficient for quantum systems. Quantum hardware demands: ●Zero-outgassing materials ●Cryogenic stability ●Permanent alignment integrity PIX-Attach delivers all three through a fundamentally different approach. If your connection outgasses, it’s a liability If it doesn’t, it’s PIX-Attach.

Photonect is proud to announce the official launch of PIX-Attach™ in March 2026, a first-of-its-kind laser fusion-based fiber attach system designed to scale fiber-to-photonic chip attachment for both advanced R&D and manufacturing environments.

Photonics is one of the most exciting technology frontiers of the 21st century — enabling high-speed communications, advanced sensing, biomedical innovations, and quantum systems. The industry is already huge: more than 4,700 companies generating over $368 billion in revenue and supporting ~1.2 million jobs worldwide. Yet despite remarkable performance metrics, many promising photonic technologies never cross the valley of death between lab proof-of-concept and commercially

Photonect will officially launch PIX-Attach™ in March 2026, a high-throughput laser fusion fiber attach system engineered to scale fiber-to-photonic chip attachment for both manufacturing and advanced R&D environments. A limited early-access program and pre-order waitlist are now open at PIX-Attach | Photonect PIX-Attach machine As integrated photonics adoption accelerates across, communications, CPO, AI infrastructure, sensing, and quantum systems, packaging throughput and

As we close out the year, we’re taking a moment to reflect on how far Photonect has come—and where we’re headed next. From growing our team to advancing our flagship technology, this year has been defined by steady execution, strong validation from the ecosystem, and growing excitement around the future of epoxy-free fiber-to-chip attachment. Here’s a snapshot of what we’ve been building.

High‑performance computing (HPC) is entering a new era. As AI models grow, compute density explodes — but traditional copper interconnects are becoming the bottleneck. Data movement, not raw FLOPS, is now the biggest obstacle. That’s where integrated photonics comes in: it promises a fundamentally more scalable, efficient, and powerful architecture for the next generation of supercomputers.

Pic Credit: Photonect The Scaling Challenge in Photonic Packaging Integrated photonics is reaching a critical stage. Photonic chips can deliver faster data transfer, lower latency, and higher energy efficiency than traditional electronic systems. However, moving from a few lab prototypes to thousands of deployable modules introduces a major challenge: scalability. For all the innovation in photonic chip design, the industry still struggles to manufacture these devices at scal

Juniyali Nauriyal, CEO & Co-Founder, Photonect Who is Juniyali Nauriyal From pioneering research in photonics to leading a high-impact startup, Juniyali Nauriyal has built her career at the intersection of science, innovation, and entrepreneurship. She is the CEO and co-founder of Photonect , where she transforms advanced photonic technologies into practical, market-ready solutions. A visionary leader and scientist, Juniyali is passionate about turning bold ideas into techno

The Hidden Cost of the Cloud: Water As cloud computing scales, the environmental cost of powering and cooling massive data centers...

Introduction: Why Drones Are Entering a New Optical Era Drones today are capable of much more than basic flight and aerial imaging. They...

If you’re evaluating Photonect’s fiber attach solution, here’s a deep dive into why fiber coupling is the linchpin of end-to-end PIC performance—and how our approach is designed to push your technology over the finish line.

While Silicon Valley dominates tech headlines, there's another valley quietly powering the world's vision—the Genesee River Valley in Rochester, NY. The optics and photonics industry (Upper experiencing unprecedented growth, with global market size projected to reach $2.39 trillion by 2030 (Mordor Intelligence). At the center of this expansion sits an unlikely champion: a mid-sized city in upstate New York that has quietly become the global epicenter of optical innovation.

Photonect introduced a SiO₂-based mode converter, designed directly into the chip layout as part of the foundry fabrication process. These mode converters are permanent, passive optical structures that act as a transitional waveguide—matching the mode size and profile between the fiber and the on-chip waveguide, dramatically reducing coupling loss.

One of the major roadblocks in scaling silicon photonics for commercial applications is efficient, reliable fiber-to-chip packaging. Conventional approaches often suffer from high optical loss, complex alignment, and limited scalability. In this research, we explore a promising solution: CO₂ laser fusion splicing combined with strategically designed on-chip silicon dioxide mode converters.

Photonect is proud to announce that we have been awarded a $1.25 million Small Business Innovation Research (SBIR) Phase II grant from the National Science Foundation (NSF) to advance the development of our PIX-Attach machine

Photonics—the science and technology of light—emerges as a silent yet powerful driver of sustainability. From enabling clean energy to transforming industrial efficiency, photonics is helping reduce the world’s carbon footprint, one photon at a time.

The demand for rapid, accurate, and non-invasive disease detection is at an all-time high. With global health crises like cancer, neurodegenerative diseases, and infectious outbreaks challenging traditional diagnostic methods, the need for highly sensitive, real-time biosensors is greater than ever. This is where photonic biosensors come into play.

Smart glasses have long been heralded as the future of wearable technology, offering seamless augmented reality (AR) integration for enterprise, healthcare, and consumer applications. However, despite advancements in AR hardware, major roadblocks remain—bulky form factors, limited battery life, and suboptimal visual performance continue to hinder widespread adoption. The solution? Photonic chips.

Virtual Reality (VR) has pushed GPUs to their limits. High latency, excessive power consumption, and processing inefficiencies are bottlenecks preventing the next leap in immersive experiences. Photonic chips, which process data using light instead of electricity, are emerging as a superior alternative.