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Photonect is excited to announce a new collaboration with ficonTEC, a global leader in automated photonic assembly, test, and fiber preparation solutions, to accelerate the industrialization of laser-fusion photonic packaging for high-volume manufacturing.

Co-Packaged Optics (CPO) is an architectural approach that integrates optical engines directly alongside switch ASICs on the same substrate. Traditionally, optical transceivers sit at the edge of a system and connect through electrical traces. CPO removes that distance by bringing optics directly next to compute.

Epoxy-based interconnects were sufficient for earlier photonics systems. They are not sufficient for quantum systems. Quantum hardware demands: ●Zero-outgassing materials ●Cryogenic stability ●Permanent alignment integrity PIX-Attach delivers all three through a fundamentally different approach. If your connection outgasses, it’s a liability If it doesn’t, it’s PIX-Attach.

Photonect is proud to announce the official launch of PIX-Attach™ in March 2026, a first-of-its-kind laser fusion-based fiber attach system designed to scale fiber-to-photonic chip attachment for both advanced R&D and manufacturing environments.