Epoxy Is Quietly Breaking Quantum Tech—Here’s the Upgrade

Quantum systems are reaching performance levels where even tiny material flaws matter. The interface between fiber and chip is no longer just a connection, it’s the difference between stability and drift.  

A Reality Check for Quantum Engineers  

Quantum systems don’t fail loudly, they drift. And more often than not, that drift starts at the fiber-to-chip interface.  

If your interconnect relies on epoxy, you are introducing:  

●Outgassing, epoxy releases trapped gases over time, increasing contamination risk and limiting achievable vacuum levels (up to 100× higher outgassing than metals)  

●Mechanical instability at cryogenic temperatures  

●Alignment drift under thermal cycling  

These are not edge-case issues. They are built into the material system.  

The real question is no longer if epoxy fails but whether your system can tolerate when it does.  

The Shift: From Adhesives to Structural Bonding  

Quantum hardware has evolved beyond the limitations of traditional packaging. The industry is moving toward:  

●Adhesion-free bonding  

●Inorganic interfaces  

●Permanent structural stability  

This is not incremental improvement, it is a necessary upgrade.  

PIX-Attach: Built for Quantum-Grade Integration  

Photonect’s PIX-Attach is engineered to eliminates the root causes of instability by replacing adhesives with laser-based glass-to-glass fusion bonding. 

1.Zero-Outgassing Architecture  

PIX-Attach removes epoxy entirely.  

●No organic materials  

●No trapped volatiles  

●No long-term contamination  

2.Cryogenic & Thermal Cycling Stability  

PIX-Attach creates a direct glass-to-glass fusion bond  

●Stable from -196°C to 220°C  

●No polymer shrinkage or creep  

●No delamination under thermal cycling  

3.Sub-Micron Precision That Holds  

PIX-Attach enables precision alignment followed by permanent fixation.  

●Packaging loss: ±0.2 dB  

●Coupling loss: <0.5–0.6 dB per facet  

4.Speed: From Minutes to Seconds  

Traditional fiber attach methods can take ~10 minutes per attachment. PIX-Attach achieves:  

●<1 second attach time  

That’s a >10× improvement in process speed enabling true scalability:  

●Up to 60 units/hour with active alignment  

●Up to 720 units/hour with passive alignment  

Unlike traditional systems, this does not come at the cost of precision  

5.Retrofit-Ready Integration  

PIX-Attach is designed to integrate into existing systems:  

●Compatible with active and passive alignment setups  

●Supports SM, PM, High NA and Custom fibers  

Conclusion  

Epoxy-based interconnects were sufficient for earlier photonics systems.  

They are not sufficient for quantum systems.  

Quantum hardware demands:  

●Zero-outgassing materials  

●Cryogenic stability  

●Permanent alignment integrity  

PIX-Attach delivers all three through a fundamentally different approach.  

If your connection outgasses, it’s a liability If it doesn’t, it’s PIX-Attach.  

Sources  

1.Photonect Technology Brochure  

2.Gupta et al., Outgassing from epoxy resins, Vacuum Journal (ScienceDirect)  

3.Hussein et al., Cryogenic behavior of epoxy materials, ScienceDirect  

4.NASA Outgassing Database, Materials in Vacuum Systems  

5.Acta Astronautica, Material behavior in space vacuum environments