Services
Photonect provides an oxide mode converter design service tailored to the size of your device mode.
This will help you decrease your insertion loss at the fiber-chip interface.
We also provide fiber-to-chip packaging service using a laser to attach them together eliminating the use of glue.
Design service for interconnect
Design service for interconnect
Designing of oxide mode converter to achieve 4X improved insertion loss
Laser attach of fiber to chip
Laser attach of fiber to chip
Laser fusion splicing between a photonic chip and a single mode fiber or fiber array
<1dB insertion loss
<1dB insertion loss
<1 min attach time
<1 min attach time
No fixtures, no glue
No fixtures, no glue