Photonect provides an oxide mode converter design service tailored to the size of your device mode.

This will help you decrease your insertion loss at the fiber-chip interface.

We also provide fiber-to-chip packaging service using a laser to attach them together eliminating the use of glue.

Design service for interconnect

Designing of oxide mode converter to achieve 4X improved insertion loss

Laser attach of fiber to chip

Laser fusion splicing between a photonic chip and a single mode fiber or fiber array

<1dB insertion loss

<1 min attach time

No fixtures, no glue