Photonect  will officially launch PIX-Attach™ in March 2026, a high-throughput laser fusion fiber attach system engineered to scale fiber-to-photonic chip attachment for both manufacturing and advanced R&D environments. A limited early-access program and pre-order waitlist are now open at PIX-Attach | Photonect PIX-Attach machine As integrated photonics adoption accelerates across, communications, CPO, AI infrastructure, sensing, and quantum systems, packaging throughput and