Photonect to Launch PIX-Attach™ Laser Fusion System in March 2026

Photonect will officially launch PIX-Attach™ in March 2026, a high-throughput laser fusion fiber attach system engineered to scale fiber-to-photonic chip attachment for both manufacturing and advanced R&D environments. A limited early-access program and pre-order waitlist are now open at PIX-Attach | Photonect

PIX-Attach machine

As integrated photonics adoption accelerates across, communications, CPO, AI infrastructure, sensing, and quantum systems, packaging throughput and repeatability have emerged as critical constraints. Conventional epoxy-based attachment workflows typically require a multi-step process involving dry alignment, adhesive application, second wet alignment, curing, and stabilization, often introducing variability, extended cycle times, and long-term reliability concerns.

PIX-Attach replaces this traditional 4-step workflow with a streamlined 2-step laser splicing process, reducing total attachment time to less than 1 minute per unit. The system is designed to achieve throughput of up to at least 60 units per hour with active alignment and up to 720 units per hour with passive alignment methodology, enabling a practical path from prototype development to pilot and volume manufacturing.

The platform supports both active and passive alignment methodologies, allowing manufacturers and research teams to select the configuration best suited to their performance and production requirements. By eliminating adhesives from the optical path, PIX-Attach reduces process variability, back reflections while improving mechanical robustness and thermal stability.

The laser-based attachment method delivers increased coupling efficiency compared to conventional epoxy-based processes due to reduction in back reflections and reduced packaging losses from epoxy shrinkage.

Designed as a modular and customizable system, PIX-Attach can be configured for varying fiber types and chip geometries. Its architecture allows integration into existing packaging workflows while supporting future manufacturing scale-up.

“Scalable photonics manufacturing requires more than precision, it requires repeatability and speed,” said Juniyali Nauriyal, CEO of Photonect. “PIX-Attach is built to enable both, delivering a controlled, high-throughput process that removes adhesives and reduces variability at the source.”

Photonect will be open to conversation about PIX-Attach at OFC 2026 at their booth #5048 and engage with photonic device manufacturers, packaging engineers, foundries, and research institutions seeking improved coupling performance and scalable integration solutions.

For more information, visit http://www.photonectcorp.com