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The Year-End Recap: 2025


Reflecting on a Year of Momentum at Photonect

As we close out the year, we’re taking a moment to reflect on how far Photonect has come—and where we’re headed next.

From growing our team to advancing our flagship technology, this year has been defined by steady execution, strong validation from the ecosystem, and growing excitement around the future of epoxy-free fiber-to-chip attachment.

Here’s a snapshot of what we’ve been building.


Team Growth & Company Foundation

Photonect continues to grow thoughtfully as we scale toward commercialization.


  • Headcount: 5 full-time employees and 2 part-time employees

  • A multidisciplinary team spanning photonics, engineering, operations, and commercialization

  • A shared focus on building manufacturable, scalable solutions for integrated photonics


This lean but focused structure allows us to move fast while staying deeply connected to customer and industry feedback.

To learn more about our team visit: About us | Photonect


Photonect Team
Photonect Team

Product Development amp; Engineering Progress

While we build toward machine commercialization, Photonect actively supports customers today through specialized services, including:


  • Fiber-to-chip attachment services, leveraging our patented laser-based, epoxy-free process 

  • Mode converter design services based on our patented SiO₂ mode converter technology.


Both our services help customers improve coupling efficiency by 4x and overall system performance with <1dB loss.

Learn more about our services here: Services | Photonect

Photonect Services
Photonect Services

Our flagship laser-based fiber-to-chip attachment system, PIX-Attach, remains on track for commercial launch in Q1 2026.

Over the past quarter, we’ve achieved several key technical milestones:


  • Built Version 1 of our semi-automated PIX-Attach machine system

  • Continued validation toward repeatable sub-second attach speeds

  • Progressed toward <1 dB loss per facet, achieved without adhesives


Each step brings us closer to demonstrating a scalable alternative to conventional photonic packaging—one that is faster, cleaner, and better suited for volume production.


Growing Customer Interest & Waitlist Momentum

We’re seeing strong inbound interest from:


  • Integrated photonics companies

  • Research labs and advanced packaging groups


Our PIX-Attach waitlist continues to grow, with several organizations expressing interest in pilot evaluations.

To maintain quality and incorporate early customer feedback, we will remain intentionally selective:


  • One machine launch per quarter

  • Tight feedback loops with early users

  • Controlled, scalable deployment


Interested in joining the waitlist or exploring a pilot program? Reach out to us at info@photonectcorp.com or fill out "Join Wait List for PIX-Attach" form: Home | Photonect


Non-Dilutive Funding & Program Support

This year marked a major step forward in validation and support for Photonect’s technology:


  • $1.25M NSF award supporting the development and commercialization of PIX-Attach

  • Selection into SEMICON NSF I-Corps, strengthening our customer discovery and market readiness efforts


These programs help accelerate our path from lab-proven innovation to industry-ready manufacturing tools, bringing you the benefits you desire.


Customer amp; Industry Engagement

We’ve been actively engaging with the broader semiconductor and photonics ecosystem:


  • SEMICON West participation through the NSF I-Corps program, supported by a $5,000 award

  • Live demo planned: PIX-Attach will be demonstrated publicly in March 2026 at OFC


📍 If you’re attending OFC 2026, we’d love to connect—especially if fiber-to-chip packaging is on your roadmap. Visit us at Booth 5048. Meanwhile you can also meet us at Photonics West at Booth 258 at NextCorps Luminate's booth (more details to follow soon)


Leadership, Recognition & Brand Visibility

This year also brought meaningful recognition for Photonect’s leadership and mission:


Emerging Technology Woman of the Year Awarded to Juniyali Nauriyal
Emerging Technology Woman of the Year Awarded to Juniyali Nauriyal

These moments reflect Photonect’s growing role in both technical innovation and leadership within the photonics community.


Media & Public Engagement


  • Guest appearance on Greater Rochester Enterprise’s Make Your Mark podcast (aired on WHAM 1180)Discussed Photonect’s journey and how epoxy-free fiber-to-chip attachment enables faster, more reliable, and cost-effective photonic integration. Learn more: GRE | Photonect

  • Invited speaker at the Ain Center, University of Rochester, engaging with students, researchers, and innovators


Key Company Milestones


  • Accepted into the REV Ithaca Manufacturing Accelerator, supporting our next phase of scaling

  • Intellectual Property milestone:7 patents across US and Europe (6 granted, 1 provisional) 

  • Registered trademark for “Photonect”, strengthening long-term protection of our technology and brand


What’s Next


  • Upcoming podcast appearance (January 5): UR Ventures – Tech Hustle-Buzzle Podcast

  • Continued system refinement and pilot planning

  • Expanded industry partnerships as we move closer to commercialization, we will be updating you about that soon


Join Us on the Journey

As photonic integration scales, packaging can no longer be the bottleneck. At Photonect, we’re building the tools to change that.

Interested in PIX-Attach demos, pilot programs, or partnerships?

Want to stay updated as we approach launch? Follow Photonect and join our growing community.

Here’s to another year of building—together.

For details visit www.photonectcorp.com or reach out to us at info@photonectcorp.com

 
 
 

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Rochester, NY, 14604

Email

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