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Scientific Text
Fiber array to chip attach using laser fusion splicing for low loss
Publisher : Optica Publishing Group
Fiber-to-chip fusion splicing for low-loss photonic packaging
Publisher : Optical Society of America
Fiber-to-Chip Packaging with Robust Fiber Fusion Splicing for Low-Temperature Applications
Publisher : IEEE
Fiber Attach Service​​
We provide low-loss fiber-attach technology for optical packaging of integrated photonics devices. Our novel fiber-attach technology is a 2 sec process and provides <1dB coupling loss per facet. Chips packaged with Photonect are solder reflow compatible and avoid the use of adhesives for packaging.
Mode Converter Designing
Through the use of carefuly designed oxide mode converters, Photonect is able to decrease insertion loss at fiber-chip interfaces beyond current industry standards. It can be integrated in the foundry process
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