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Fiber Attach Service​​
We provide low-loss fiber-attach technology for optical packaging of integrated photonics devices. Our novel fiber-attach technology is a 2 sec process and provides <1dB coupling loss per facet. Chips packaged with Photonect Interconnect Solutions are solder reflow compatible and avoid the use of adhesives for packaging.
Mode Converter Designing
Through the use of carefuly designed oxide mode converters, Photonect is able to decrease insertion loss at fiber-chip interfaces beyond current industry standards. It can be integrated in the foundry process
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