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Find us at OFC 2026 

Visit us at Booth no. 5011

Our Services

10X Faster 

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< 1dB Loss

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Up to 50%
Savings

Scientific Text

Fiber-to-chip fusion splicing for low-loss photonic packaging

Publisher : Optical Society of America

Fiber array to chip attach using laser fusion splicing for low loss

Publisher : Optica Publishing Group

Low-Loss, High Extinction Ratio Fiber to Chip Connection via Laser Fusion for Polarization Maintaining Fibers

Publisher : IEEE

Fiber-to-Chip Packaging with Robust Fiber Fusion Splicing for Low-Temperature Applications

Publisher : IEEE

News

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Photonect Featured in New America’s Deep Tech Innovation Report: Advancing U.S. Semiconductor Capabilities​​

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Read More>>

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Photonect Leverages Ansys Simulation Tools to Revolutionize Photonic Chip Connectivity and Drive Sustainability

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Read More>>​

Whether you're a potential partner, investor, vendor, or simply curious, we'd love to hear from you—reach out today!

Address 

260 E. Main Street , Suite 6108

Rochester, NY, 14604

Email

info@photonectcorp.com

Socials 

LinkedIn 

Epoxy Free Connection for The Future of Photonics

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