Epoxy Free
Connection For The
Future Of Photonics
Supported by
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Photonect is transforming photonic packaging by eliminating one of the industry’s most persistent bottlenecks: slow, costly, and unstable fiber-to-chip attachment. Our patented oxide mode converter and adhesive-free laser fusion process create permanent glass-to-glass bonds in under a minute—boosting coupling efficiency from 50% to 80%, increasing throughput by 10×, and reducing per-device costs by 50% while maintaining <1 dB coupling loss.
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We provide low-loss fiber-attach technology for optical packaging of integrated photonic devices. Our novel fiber-attach technology is a 1 sec process and provides <0.8 dB loss in a fully packaged device. Chips packaged with Photonect are solder reflow compatible and avoid the use of adhesives for packaging.
Through the use of carefully designed oxide mode converters, Photonect is able to decrease insertion loss at fiber-chip interfaces beyond current industry standards. It can be integrated in the foundry process.
