Photonect is transforming photonic packaging by eliminating one of the industry’s most persistent bottlenecks: slow, costly, and unstable fiber-to-chip attachment. Our patented oxide mode converter and adhesive-free laser fusion process create permanent glass-to-glass bonds in under a minute—boosting coupling efficiency from 50% to 80%, increasing throughput by 10×, and reducing per-device costs by 50% while maintaining <1 dB coupling loss.